The industrial electronic packaging market to reach a net

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DUBAI, United Arab Emirates, Jan. 18, 2022 (GLOBE NEWSWIRE) — The global industrial electronics packaging market currently enjoys a valuation of US$1.9 billion, and is expected to grow at a CAGR of 4.1% to achieve a net worth of US$2.5 billion by the end of 2029.

Industrial Electronic Packaging Market Size (2022) US$1.9 billion
Estimated market value (2029) US$2.5 billion
Global Market Growth (2022-2029) CAGR of 4.1%
Dominant material for the packaging of industrial electronic products Plastic – 57.4% share

Nearly 3.5% annual growth is expected in the volume consumption of packaging solutions for industrial electronics, in 2022. As indicated by new market research from Future Market Insights (IMF), nearly 70 % of industrial electronics packaging demand is driven by controls and power electronics.

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Over 90% of all packaging solutions for industrial electronics are rigid. Flexible packaging formats, although rapidly gaining ground in all industries, hold a negligible share in industrial electronics packaging.

From a material perspective, plastics currently hold nearly 60% of the industrial electronics packaging material share and are expected to maintain their dominant position in the global industrial electronics packaging market. The report estimates that polyethylene (PE) will remain the most rewarding segment of the industrial electronics packaging market, followed by polyvinyl chloride (PVC), according to the report.

Asian economies offer promising investment opportunities for industrial electronics packaging companies

North America is estimated to be the largest industrial electronic packaging market, the report also highlights the robust growth in East Asia market attractiveness over the coming years. The East Asian industrial electronics packaging market will therefore remain an important regional competitor in the industrial electronics packaging landscape, according to IMF analysis.

In East Asia, Japan holds more than 50% market share, followed by China. South Asia is also cited as a highly lucrative investment pocket for manufacturers of industrial electronics packaging solutions, potentially outpacing other regional markets in terms of growth rate. The growth of the South and East Asia market is attributed to rugged consumer electronics manufacturing and growing demand for impact-resistant protective packaging solutions.

Europe is another important market for industrial electronic packaging, of which more than 60% is represented by Germany. The country will continue to spearhead the European market due to the high production rate of semiconductor components and equipment.

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Europe and the United States account for a massive share of global industrial electronics production

Manufacturers of industrial electronics packaging are eyeing business expansion in countries with high consumer electronics production, in a bid to strengthen their presence in the global industrial electronics packaging market. Major manufacturers of industrial electronics packaging are based in the United States or Europe, or have a strong presence in these regions, as the two markets have a collective share of over 60% in global electronics production industrial.

Scope of the Industrial Electronic Packaging Industry Report

Attribute Details
Forecast period 2022-2029
Historical data available for 2014-2021
Market analysis US$ million for value
Key regions covered
  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia and the Pacific
  • Middle East and Africa (MEA)
Main countries covered
  • United States
  • Canada
  • Brazil
  • Mexico
  • Germany
  • UK
  • France
  • Spain
  • Italy
  • China
  • Japan
  • South Korea
  • India
  • Indonesia
  • Malaysia
  • Singapore
  • Australia
  • New Zealand
  • Turkey
  • South Africa
  • and GCC countries
Key Market Segments Covered
  • type of product
  • type of material
  • Type of packaging
  • Region
Profiled Key Companies
  • DS Smith Plc.
  • Smurfit Kappa Group Plc.
  • UFP Technologies Inc.
  • Airline Sealed
  • Achilles Society
  • Desco Industries Inc.
  • Botron company inc.
  • Kiva Container Corporation
  • Orlando Products Inc.
  • Delphon Industries LLC
  • Summit Container Corporation
  • Protective packaging company
  • Dou Yee Enterprises (S) Pte Ltd.
  • Dordan Manufacturing Company Inc.
  • Limited GWP Group
  • Pure-Stat Engineering Technologies Inc.
  • AUER Packaging GmbH
  • Cre-O-Pack International Packaging Inc.
  • Universal Protective Packaging Inc.

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About Packaging Division at Future Market Insights

FMI’s Packaging Division provides in-depth historical analysis and granular projections of the global packaging market. From packaging materials to designs and formats, FMI has an extensive market research database, providing customers with unique offers and strategic recommendations. With a repository of over 750 reports, the team has comprehensively analyzed the packaging industry in over 70 countries.

Explore FMI’s extensive ongoing packaging coverage

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About Future Market Insights (IMF)

Future Market Insights (FMI) is a leading provider of market information and advisory services, serving clients in over 150 countries. FMI is headquartered in Dubai and has delivery centers in the UK, USA and India. FMI’s latest market research reports and industry analysis help businesses meet challenges and make critical decisions with confidence and clarity amidst fierce competition. Our custom and syndicated market research reports deliver actionable insights that drive sustainable growth. A team of analysts led by FMI experts continuously monitor emerging trends and events across a wide range of industries to ensure our clients are prepared for the changing needs of their consumers.

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Source of the press release: https://www.futuremarketinsights.com/press-release/industrial-electronics-packaging-market

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